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important notice dear customer, on 7 february 2017 the former nxp standard product business became a new compa ny with the tradename nexperia . nexperia is an industry leading supplier of discrete, logic and pow ermos semiconductors with its focus on the automotive, industrial, computing, consume r and wearable application markets in data sheets and application notes which still contain nxp or philips se miconductors references, use the references to nexperia, as shown below. instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors .philips.com/ , use http://www.nexperia.com instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) replace the copyright notice at the bottom of each page or elsewher e in the document, depending on the version, as shown below: - ? nxp n.v. (year). all rights reserved or ? koninklijke philips electronics n.v. (year). all rights reserved should be replaced with: - ? nexperia b.v. (year). all rights reserved . if you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com ). thank you for your cooperation and understanding, kind regards, team nexperia downloaded from: http:///
1. product pro?e 1.1 general description PESD1FLEX in a small sot23 (to-236ab) surface-mounted device (smd) plastic package designed to protect two automotive flexray bus lines from the damage caused by electrostatic discharge (esd) and other transients. 1.2 features due to the integrated diode structure only one small sot23 package is needed to protect two flexray bus lines max. peak pulse power: p pp = 200 w at t p = 8/20 s low clamping voltage: v cl = 40 v at i pp =1a ultra low leakage current: i rm <1na typ. diode capacitance matching: ? c d /c d = 0.1 % esd protection up to 23 kv iec 61000-4-2, level 4 (esd) iec 61000-4-5 (surge); i pp = 3 a at t p = 8/20 s small smd plastic package 1.3 applications flexray bus protection automotive applications 1.4 quick reference data PESD1FLEX flexray bus esd protection diode rev. 02 ?15 february 2008 product data sheet table 1. quick reference data t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit per diode v rwm reverse standoff voltage - - 24 v c d diode capacitance f = 5 mhz; v r = 0 v- 1 11 7p f downloaded from: http:///
PESD1FLEX_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 ?15 february 2008 2 of 12 nxp semiconductors PESD1FLEX flexray bus esd protection diode 2. pinning information 3. ordering information 4. marking [1] * = -: made in hong kong * = p: made in hong kong * = t: made in malaysia * = w: made in china 5. limiting values [1] non-repetitive current pulse 8/20 s exponential decay waveform according to iec 61000-4-5. [2] measured from pin 1 to 3 or 2 to 3. table 2. pinning pin description simpli?d outline symbol 1 cathode 1 2 cathode 2 3 common cathode 12 3 2 1 006aaa155 3 table 3. ordering information type number package name description version PESD1FLEX - plastic surface-mounted package; 3 leads sot23 table 4. marking codes type number marking code [1] PESD1FLEX zj* table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit per diode p pp peak pulse power t p = 8/20 s [1] [2] - 200 w i pp peak pulse current t p = 8/20 s [1] [2] -3a per device t j junction temperature - 150 c t amb ambient temperature ? 65 +150 c t stg storage temperature ? 65 +150 c downloaded from: http:///
PESD1FLEX_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 ?15 february 2008 3 of 12 nxp semiconductors PESD1FLEX flexray bus esd protection diode [1] device stressed with ten non-repetitive esd pulses. [2] measured from pin 1 to 3 or 2 to 3. table 6. esd maximum ratings symbol parameter conditions min max unit per diode v esd electrostatic discharge voltage iec 61000-4-2 (contact discharge) [1] [2] -2 3k v mil-std-883 (human body model) -1 0k v table 7. esd standards compliance standard conditions per diode iec 61000-4-2; level 4 (esd) > 15 kv (air); > 8 kv (contact) mil-std-883; class 3 (human body model) > 4 kv fig 1. 8/20 s pulse waveform according to iec 61000-4-5 fig 2. esd pulse waveform according to iec 61000-4-2 t ( s) 04 0 30 10 20 001aaa630 40 80 120 i pp (%) 0 e ? t 100 % i pp ; 8 s 50 % i pp ; 20 s 001aaa631 i pp 100 % 90 % t 30 ns 60 ns 10 % t r = 0.7 ns to 1 ns downloaded from: http:///
PESD1FLEX_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 ?15 february 2008 4 of 12 nxp semiconductors PESD1FLEX flexray bus esd protection diode 6. characteristics [1] ? c d is the difference of the capacitance measured between pin 1 and pin 3 and the capacitance measured between pin 2 and pin 3. [2] non-repetitive current pulse 8/20 s exponential decay waveform according to iec 61000-4-5. [3] measured from pin 1 to 3 or 2 to 3. table 8. characteristics t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit per diode v rwm reverse standoff voltage - - 24 v i rm reverse leakage current v rwm =24v - <1 50 na v br breakdown voltage i r = 5 ma 25.4 27.8 30.3 v c d diode capacitance f = 5 mhz; v r = 0 v - 1 11 7p f ? c d /c d diode capacitancematching [1] f = 5 mhz; v r =0v - 0.1 - % f = 5 mhz; v r = 2.5 v - 0.1 - % v cl clamping voltage [2] [3] i pp = 1 a --4 0v i pp = 3 a --7 0v r dif differential resistance i r = 1 ma - - 300 downloaded from: http:///
PESD1FLEX_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 ?15 february 2008 5 of 12 nxp semiconductors PESD1FLEX flexray bus esd protection diode t amb =25 c fig 3. peak pulse power as a function of exponential pulse duration; typical values fig 4. relative variation of peak pulse power as a function of junction temperature; typical values f = 5 mhz; t amb =25 c fig 5. diode capacitance as a function of reverse voltage; typical values fig 6. v-i characteristics for a bidirectional esd protection diode 006aaa257 10 3 10 2 10 4 p pp (w) 10 t p ( s) 11 0 4 10 3 10 10 2 t j ( c) 0 200 150 50 100 001aaa193 0.4 0.8 1.2 p pp 0 p pp(25 c) v r (v) 02 5 20 10 15 5 006aaa258 8 12 4 16 20 c d (pf) 0 006aaa676 ? v cl ? v br ? v rwm v cl v br v rwm ? i rm i rm ? i r i r ? i pp i pp ? + downloaded from: http:///
PESD1FLEX_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 ?15 february 2008 6 of 12 nxp semiconductors PESD1FLEX flexray bus esd protection diode fig 7. esd clamping test setup and waveforms 006aaa259 50 r z c z d.u.t. (device under test) vertical scale = 200 v/div horizontal scale = 50 ns/div unclamped + 1 kv esd voltage waveform (iec 61000-4-2 network) clamped + 1 kv esd voltage waveform (iec 61000-4-2 network) unclamped ? 1 kv esd voltage waveform (iec 61000-4-2 network) clamped ? 1 kv esd voltage waveform (iec 61000-4-2 network) vertical scale = 200 v/div horizontal scale = 50 ns/div vertical scale = 20 v/div; horizontal scale = 50 ns/div vertical scale = 20 v/div; horizontal scale = 50 ns/div gndgnd 450 rg 223/u 50 coax esd tester iec 61000-4-2 networkc z = 150 pf; r z = 330 4 ghz digital oscilloscope 10 attenuator gnd gnd downloaded from: http:///
PESD1FLEX_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 ?15 february 2008 7 of 12 nxp semiconductors PESD1FLEX flexray bus esd protection diode 7. application information the PESD1FLEX is designed for the protection of two automotive flexray data lines from the damage caused by esd and surge pulses. the device supports a flexray data rate of 10 mbit/s. the PESD1FLEX provides a surge capability of up to 200 w per line for an 8/20 s waveform. circuit board layout and protection device placement: circuit board layout is critical for the suppression of esd, electrical fast transient (eft) and surge transients. the following guidelines are recommended: 1. place the PESD1FLEX as close to the input terminal or connector as possible. 2. the path length between the PESD1FLEX and the protected line should be minimized. 3. keep parallel signal paths to a minimum. 4. avoid running protection conductors in parallel with unprotected conductors. 5. minimize all printed-circuit board (pcb) conductive loops including power and ground loops. 6. minimize the length of the transient return path to ground. 7. avoid using shared transient return paths to a common ground point. 8. ground planes should be used whenever possible. for multilayer pcbs, use ground vias. fig 8. typical application: esd protection of two automotive flexray bus lines 006aab053 flexray transceiver flexray bus common mode choke (optional) bm r t/2 r t/2 c g PESD1FLEX bp 21 3 downloaded from: http:///
PESD1FLEX_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 ?15 february 2008 8 of 12 nxp semiconductors PESD1FLEX flexray bus esd protection diode 8. package outline 9. packing information [1] for further information and the availability of packing methods, see section 13 . fig 9. package outline sot23 (to-236ab) 04-11-04 dimensions in mm 0.450.15 1.9 1.10.9 3.02.8 2.52.1 1.41.2 0.480.38 0.150.09 12 3 table 9. packing methods the indicated -xxx are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 PESD1FLEX sot23 4 mm pitch, 8 mm tape and reel -215 -235 downloaded from: http:///
PESD1FLEX_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 ?15 february 2008 9 of 12 nxp semiconductors PESD1FLEX flexray bus esd protection diode 10. soldering fig 10. re?w soldering footprint sot23 (to-236ab) fig 11. wave soldering footprint sot23 (to-236ab) solder resist occupied area solder lands solder paste dimensions in mm sot023 1.00 0.60 (3x) 1.30 1 2 3 2.50 3.00 0.85 2.70 2.90 0.50 (3x) 0.60 (3x) 3.30 0.85 sot023 4.00 4.60 2.80 4.50 1.20 3.40 3 21 1.20 (2x) preferred transport direction during soldering dimensions in mm solder resist occupied area solder lands downloaded from: http:///
PESD1FLEX_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 ?15 february 2008 10 of 12 nxp semiconductors PESD1FLEX flexray bus esd protection diode 11. revision history table 10. revision history document id release date data sheet status change notice supersedes PESD1FLEX_2 20080215 product data sheet - PESD1FLEX_1 modi?cations: section 1.2 f eatures : list item for diode capacitance matching added t ab le 8 char acter istics : ? c d /c d diode capacitance matching added PESD1FLEX_1 20070521 product data sheet - - downloaded from: http:///
PESD1FLEX_2 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 02 ?15 february 2008 11 of 12 nxp semiconductors PESD1FLEX flexray bus esd protection diode 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest product status information is available on the internet at url http://www .nxp .com . 12.2 de?itions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 12.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 12.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 13. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?ition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation. downloaded from: http:///
nxp semiconductors PESD1FLEX flexray bus esd protection diode ?nxp b.v. 2008. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 15 february 2008 document identifier: PESD1FLEX_2 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 14. contents 1 product pro?e . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 application information. . . . . . . . . . . . . . . . . . . 7 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 packing information. . . . . . . . . . . . . . . . . . . . . . 8 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 11 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 12.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13 contact information. . . . . . . . . . . . . . . . . . . . . 11 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 downloaded from: http:///

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